Back to results
US 2019/0104607 A1Published application
Apparatus, system, and method for precise heatsink alignment on circuit boards
AssigneeJuniper Networks, Inc.
InventorsPeng Su, Gautam Ganguly, Marc D. Hartranft
Life of this patent
Estimating the term…
Abstract
The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.
Claims20
An apparatus comprising:
- at least one alignment pin that:
- is placed proximate to a component on a circuit board;
- and
- is secured proximate to the component on the circuit board;
- at least one heatsink that:
- is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board;
- is aligned by the alignment pin such that the heatsink resides in a specific position atop the component;
- and
- absorbs heat dissipated by the component when the component is operational;
- at least one additional alignment pin that is secured proximate to an additional component on the circuit board;
- and
- at least one additional heatsink that:
- is placed atop the additional component after completion of the reflow process;
- is aligned by the additional alignment pin such that the additional heatsink resides in a specific position atop the additional component;
- and
- absorbs heat dissipated by the additional component when the component is operational;
- wherein the heatsink and the additional heatsink are:
- thermally isolated from one another;
- and
- aligned relative to one another by the alignment pin and the additional alignment pin to prevent thermal contact between the heatsink and the additional heatsink.
17 more elements
(canceled)
(canceled)
A circuit board comprising:
- at least one component;
- at least one alignment pin that:
- is placed proximate to the component;
- and
- is secured proximate to the component;
- and
- at least one heatsink that:
- is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board;
- is aligned by the alignment pin such that the heatsink resides in a specific position atop the component;
- and
- absorbs heat dissipated by the component when the component is operational;
- at least one additional alignment pin that is secured proximate to an additional component on the circuit board;
- and
- at least one additional heatsink that:
- is placed atop the additional component after completion of the reflow process;
- is aligned by the additional alignment pin such that the additional heatsink resides in a specific position atop the additional component;
- and
- absorbs heat dissipated by the additional component when the component is operational;
- wherein the heatsink and the additional heatsink are:
- thermally isolated from one another;
- and
- aligned relative to one another by the alignment pin and the additional alignment pin to prevent thermal contact between the heatsink and the additional heatsink.
19 more elements
A method comprising:
- placing at least one alignment pin atop at least one solder pad located proximate to a component on a circuit board;
- securing the alignment pin proximate to the component on the circuit board;
- placing at least one heatsink atop the component after completion of a reflow soldering process in which the component is soldered to the circuit board;
- and
- aligning the heatsink via the alignment pin such that the heatsink resides in a specific position atop the component;
- placing at least one additional alignment pin atop at least one additional solder pad located proximate to an additional component on the circuit board;
- securing the additional alignment pin proximate to the additional component on the circuit board;
- placing at least one additional heatsink atop the additional component after completion of a reflow soldering process in which the additional component is soldered to the circuit board;
- and
- aligning the heatsink via the additional alignment pin such that the additional heatsink resides in a specific position atop the additional component and is thermally isolated from the heatsink.
7 more elements
Dependencies are inferred from the claim text.