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US 2019/0104260 A1Published application
Solid-state imaging element, imaging device, and electronic device
AssigneeSony Corporation
InventorKunihiko IZUHARA
Life of this patent
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Abstract
A solid-state imaging element includes a first substrate including a pixel circuit having a pixel array unit, and a second substrate. The second substrate includes signal processing circuits to process signals from the pixel array unit, and a wiring layer with wiring regions electrically connected to respective ones of the signal processing circuits. Each signal processing circuit has a same circuit pattern. The second substrate and the first substrate are stacked. A wiring pattern of each wiring region is different.
Claims21
A solid-state imaging element, comprising:
- a first substrate including a pixel circuit having a pixel array unit;
- and
- a second substrate including:
- signal processing circuits to process signals from the pixel array unit;
- and
- a wiring layer with wiring regions electrically connected to respective ones of the signal processing circuits,
- wherein each signal processing circuit has a same circuit pattern,
- wherein the second substrate and the first substrate are stacked, and
- wherein a wiring pattern of each wiring region is different.
6 more elements
An imaging device, comprising:
- a first substrate including a pixel circuit having a pixel array unit;
- and
- a second substrate including:
- signal processing circuits to process signals from the pixel array unit;
- and
- a wiring layer with wiring regions connected to respective ones of the signal processing circuits,
- wherein each signal processing circuit has a same circuit pattern,
- wherein the second substrate is stacked on the first substrate, and
- wherein a wiring pattern of each wiring region is different.
6 more elements
An electronic device, comprising:
- a first substrate including a pixel circuit having a pixel array unit;
- and
- a second substrate including:
- signal processing circuits to process signals from the pixel array unit;
- and
- a wiring layer with wiring regions connected to respective ones of the signal processing circuits,
- wherein each signal processing circuit has a same circuit pattern,
- wherein the second substrate is stacked on the first substrate, and
- wherein a wiring pattern of each wiring region is different.
6 more elements
Dependencies are inferred from the claim text.