Interface for parallel configuration of programmable devices
AssigneeIntel Corporation
InventorsKevin Clark, Scott J. Weber, James Ball, Simon Chong, Ravi Prakash Gutala, Aravind Raghavendra Dasu
Life of this patent
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Abstract
An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die and having configuration memory. The integrated circuit device may also include a base die that may provide memory and/or operating supporting circuitry. The first die and the second die may be coupled using a high-speed parallel interface. The interface may employ microbumps. The first die and the second die may also include controllers for the interface.
Claims27
An integrated circuit device comprising:
- a first integrated circuit die comprising first circuitry that comprises a memory, a register, or both, and a first controller for a microbump interface;
- and
- a second integrated circuit die comprising a second controller for the microbump interface, wherein the first controller and the second controller are coupled via a control interface that comprises a microbump connection.
A method to program a programmable logic device, comprising:
- sending a write request from a first controller of a microbump interface disposed in a fabric die to a second controller of the microbump interface disposed in a base die using a first control interface that comprises a microbump connection, wherein the fabric die and the base die are coupled via the microbump interface;
- transmitting a first portion of configuration data from a memory in the base die to a data register in the fabric die using the microbump interface, wherein the microbump interface comprises a plurality of channels;
- and
- loading the first portion of the configuration data from the data register to a configuration memory of the fabric die.
An electronic device, comprising:
- a fabric die that comprises:
- programmable fabric;
- configuration memory configured to program the programmable fabric;
- and
- a first controller for a microbump interface;
- and
- a base die coupled to the fabric die via the microbump interface, comprising a second controller for the microbump interface coupled to the first controller via a microbump connection, wherein the first controller and the second controller are configured to control exchange of configuration data between the base die and the configuration memory via the microbump interface.
Dependencies are inferred from the claim text.