Polymer lid wafer-level package with an electrically and thermally conductive pillar

A structure, comprising:

• a device substrate having an upper surface;
• a frame layer having an upper surface, the frame layer being disposed over the upper surface of the device substrate, wherein a first opening, and a second opening exists in the frame layer;
• a first seed layer disposed over the device substrate, and bounded by the first opening;
• a second seed layer disposed over the device substrate, and substantially bounded by the second opening;
• a lid layer having an upper surface, the lid layer disposed over the upper surface of the frame layer, wherein:
• a third opening exists in the lid layer, the third opening being aligned with the first opening;
• and a fourth opening exists in the lid layer, the fourth opening being aligned with the second opening;
• a first electrically and thermally conductive pillar disposed in the first opening and the third opening, the first electrically and thermally conductive pillar having an upper surface that is beneath the upper surface of the lid layer;
• a first electrically and thermally conductive layer disposed over the upper surface of the first electrically and thermally conductive pillar, and extending above the upper surface of the lid layer;
• a second electrically and thermally conductive pillar disposed in the second opening and the fourth opening, the second electrically and thermally conductive pillar having an upper surface that is beneath the upper surface of the lid layer;
• and
• a second electrically and thermally conductive layer disposed over the upper surface of the second electrically and thermally conductive pillar, and extending above the upper surface of the lid layer.