Thermal solution on latch for sodimm connector
AssigneeIntel Corporation
InventorsXiang LI, George VERGIS, Douglas HEYMANN
Life of this patent
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Abstract
Embodiments include devices, systems, and methods relating to removing heat from a memory module in a connector. One embodiment relates to a memory module connector comprising a first arm, a second arm, and a body portion positioned between the first arm and the second arm, the body portion configured to accept a memory module therein. The memory module connector includes a structure coupled to the first arm and configured to be electrically coupled to a printed circuit board. The memory module connector also includes a heat spreader coupled to the first arm, the heat spreader configured to be brought into thermal contact with a memory module component. Other embodiments are described and claimed.
Claims20
A memory module connector comprising:
- a first arm;
- a second arm;
- a body portion positioned between the first arm and the second arm, the body portion configured to accept a memory module therein;
- a structure coupled to the first arm and configured to be electrically coupled to a printed circuit board;
- and
- a heat spreader coupled to the first arm, the heat spreader configured to be brought into thermal contact with a memory module component.
A system comprising:
- a memory module including a plurality of memory chips and an additional component thereon;
- a printed circuit board;
- a connector coupled to the printed circuit board, the connector configured to accept the memory module therein, the connector comprising a first arm, a second arm, and a body portion between the first arm and the second arm;
- the connector including a structure coupled to the first arm that is positioned to provide a ground plane pathway from the connector to the printed circuit board;
- the connector including a heat spreader coupled to the first arm;
- and
- the additional component being positioned in thermal contact with the heat spreader.
A method comprising:
- providing a memory module connector with a structure configured to provide a ground plane pathway from the memory module connector to a printed circuit board;
- and
- providing the memory module connector with a heat spreader positioned to transmit heat from a component on a memory module through the structure configured to provide the ground plane pathway and to the printed circuit board.
Dependencies are inferred from the claim text.