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US 2019/0103687 A1Published application
Cpu socket contact for improving bandwidth throughput
AssigneeIntel Corporation
InventorsGREGORIO R. MURTAGIAN, ZHICHAO ZHANG
Life of this patent
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Abstract
High-speed data transmissions through a CPU socket are facilitated with CPU socket contacts that have a CPU socket contact body that improves bandwidth throughput. The CPU socket contact body is partially suspended from a CPU socket contact and may include a cavity. The CPU socket contact body includes capacitive impedance that substantially cancels an inductive impedance of the CPU socket contact. Canceling the inductive impedance causes the CPU socket contact to operate like an impedance-matched coaxial transmission line, which enables better bandwidth throughput than a non-impedance matched transmission line.
Claims25
A central processing unit (“CPU”) socket contact, comprising:
- a solder ball base that extends along a horizontal plane and that is configured to couple the CPU socket contact to a motherboard;
- a spring arm to suspend a CPU landing pad contact tip at one or more distances from the solder ball base;
- a spine coupled between the solder ball base and the spring arm;
- and
- a CPU socket contact body that is coupled to the spine and that includes a cavity comprising a plurality of cavity surfaces that are each perpendicular to the horizontal plane;
- wherein:
- the CPU socket contact body generates a capacitive impedance that at least substantially negates an inductive impedance of the CPU socket contact;
- and
- the plurality of cavity surfaces capacitively couple the CPU socket contact to adjacent CPU socket contacts of a plurality of CPU socket contacts in a CPU socket.
6 more elements
A central processing unit (“CPU”) socket, comprising:
- a socket body, including:
- a first side configured to be mated proximate to a motherboard;
- and
- a second side configured to carry a CPU;
- and
- a CPU socket contact that is one of a plurality of CPU socket contacts coupled to the socket body and extending between the first side and the second side to electrically couple the CPU to the motherboard, wherein the CPU socket contact includes:
- a solder ball base that extends along a horizontal plane and that is configured to couple the CPU socket contact to the motherboard;
- a spring arm to suspend a CPU landing pad contact tip at one or more distances from the solder ball base;
- a spine coupled between the solder ball base and the spring arm;
- and
- a CPU socket contact body that is coupled to the spine and that includes a cavity comprising a plurality of cavity surfaces that are each perpendicular to the horizontal plane;
- wherein:
- the CPU socket contact body generates a capacitive impedance that at least substantially negates an inductive impedance of the CPU socket contact;
- and
- the plurality of cavity surfaces capacitively couple the CPU socket contact to adjacent CPU socket contacts of the plurality of CPU socket contacts.
12 more elements
A central processing unit (“CPU”) socket, comprising:
- a socket body, including:
- a first side configured to be mated proximate to a motherboard;
- and
- a second side configured to carry a CPU;
- and
- a CPU socket contact that is one of a plurality of CPU socket contacts coupled to the socket body and extending between the first side and the second side to electrically couple the CPU to the motherboard, wherein the CPU socket contact includes:
- a solder ball base that extends along a horizontal plane and that is configured to couple the CPU socket contact to the motherboard;
- a spring arm to suspend a CPU landing pad contact tip at one or more distances from the solder ball base;
- a spine coupled between the solder ball base and the spring arm;
- and
- a CPU socket contact body that is coupled to the spine and that includes a cavity comprising a plurality of cavity surfaces that are each perpendicular to the horizontal plane,
- wherein:
- the CPU socket contact body induces a capacitive impedance that at least substantially negates an inductive impedance of the CPU socket contact;
- and
- the plurality of cavity surfaces capacitively couple the CPU socket contact to adjacent CPU socket contacts of the plurality of CPU socket contacts.
12 more elements
A method of manufacturing a central processing unit (“CPU”) socket contact, the method comprising:
- forming a solder ball base that extends along a horizontal plane and that is configured to couple the CPU socket contact to a motherboard;
- forming a contact tip configured to receive contact from a landing pad of a CPU;
- forming a spring arm to suspend the contact tip at one or more distances from the solder ball base;
- forming a spine coupled between the solder ball base and the spring arm;
- and
- forming a CPU socket contact body that is coupled to the spine and that includes a cavity comprising a plurality of cavity surfaces that are each perpendicular to the horizontal plane,
- wherein:
- the CPU socket contact body generates a capacitive impedance that at least substantially negates an inductive impedance of the CPU socket contact body;
- and
- the plurality of cavity surfaces capacitively couple the CPU socket contact to adjacent CPU socket contacts of a plurality of CPU socket contacts in a CPU socket.
7 more elements
Dependencies are inferred from the claim text.