3d ic antenna array with laminated high-k dielectric

A semiconductor package device comprising:

• a semiconductor die;
• a first ground plane in a first metal layer of the semiconductor package device, the first ground plane electrically coupled to the semiconductor die, and the first ground plane including a plurality of openings defined by inner sidewalls of the first ground plane;
• a first antenna plane in a second metal layer of the semiconductor package device, the first antenna plane being disposed over the first ground plane and configured to transmit and receive electromagnetic radiation through the plurality of openings in the first ground plane;
• a first laminated dielectric structure separating the first ground plane and the first antenna plane, the first laminated dielectric structure comprising a plurality of layers of dielectric materials disposed upon one another and having an effective dielectric constant;
• and
• a first dielectric material having a first dielectric constant and encapsulating the first ground plane, the first antenna plane, and the first laminated dielectric structure, wherein a ratio of the effective dielectric constant to the first dielectric constant is greater than about 20.

A method of forming an integrated antenna semiconductor package comprising:

• forming a first redistribution structure over a protective layer formed over a carrier wafer;
• attaching an integrated circuit (IC) die to the protective layer and laterally encapsulating the IC die in a first dielectric material;
• forming a second redistribution structure over and electrically coupled to the first redistribution structure and IC die, the second redistribution structure comprising a first conductive plate and a second dielectric material;
• forming a recess within the second dielectric material exposing an upper surface of the first conductive plate;
• filling the recess with a laminated dielectric structure, the laminated dielectric structure comprising a plurality of layers of dielectric materials formed upon one another;
• and
• forming a third redistribution structure electrically coupled to the second redistribution structure, and comprising a second conductive plate formed over the laminated dielectric structure, wherein one of the first or second conductive plates is configured to transmit and receive electromagnetic radiation through openings in the other first or second conductive plate.