Mountable Antenna Fabrication and Integration Methods
AssigneePhazr, Inc.
InventorSidharth Balasubramanian
Life of this patent
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Abstract
A method for fabricating a printed circuit board (PCB) antenna includes fabricating a first unit, wherein fabricating the first unit comprises forming a first dielectric substrate layer and forming one or more first radiating elements disposed on the first dielectric substrate layer. The method includes fabricating a second unit, wherein fabricating the second unit comprises forming a ground plane layer, forming a second dielectric substrate layer disposed on the ground plane layer and forming antenna feed lines disposed on the second dielectric substrate layer. The method includes integrating the first unit and the second unit by placing the first dielectric substrate layer on the antenna feed lines.
Claims19
A method for integrating an antenna onto a printed circuit board (PCB), comprising:
- fabricating a first unit, wherein fabricating the first unit comprises:
- forming a first dielectric substrate layer;
- forming one or more first radiating elements disposed on the first dielectric substrate layer;
- fabricating a second unit, wherein fabricating the second unit comprises:
- forming a ground plane layer;
- forming a second dielectric substrate layer disposed on the ground plane layer;
- forming antenna feed lines disposed on the second dielectric substrate layer;
- integrating the first unit and the second unit by placing the first dielectric substrate layer on the antenna feed lines.
A method for fabricating a printed circuit board (PCB) antenna, comprising:
- fabricating a first unit, wherein fabricating the first unit comprises:
- forming a first dielectric substrate layer;
- forming one or more first radiating elements disposed on a first side of the first dielectric substrate layer;
- forming antenna feed lines disposed on a second side of the first dielectric substrate layer;
- fabricating a second unit, wherein fabricating the second unit comprises:
- forming a ground plane layer;
- forming a second dielectric substrate layer disposed on the ground plane layer;
- integrating the first unit and the second unit by placing the antenna feed lines on the second dielectric substrate.
Dependencies are inferred from the claim text.