US 2019/0103652 A1 · PACKAGE STRUCTURE

Abstract

A package structure including an insulating encapsulation, at least one semiconductor die, at least one first antenna and at least one second antenna is provided. The insulating encapsulation includes a first portion, a second portion and a third portion, wherein the second portion is located between the first portion and the third portion. The at least one semiconductor die is encapsulated in the first portion of the insulating encapsulation, and the second portion and the third portion are stacked on the at least one semiconductor die. The at least one first antenna is electrically connected to the at least one semiconductor die and encapsulated in the third portion of the insulating encapsulation. The at least one second antenna is electrically connected to the at least one semiconductor die and encapsulated in the second portion of the insulating encapsulation.

Claims20

Dependent claims

A package structure, comprising:

an insulating encapsulation comprising a first portion, a second portion and a third portion, wherein the second portion is located between the first portion and the third portion;
at least one semiconductor die encapsulated in the first portion of the insulating encapsulation, wherein the second portion and the third portion are stacked on the at least one semiconductor die;
at least one first antenna electrically connected to the at least one semiconductor die and encapsulated in the third portion of the insulating encapsulation;
and
at least one second antenna electrically connected to the at least one semiconductor die and encapsulated in the second portion of the insulating encapsulation.

2 more elements

A package structure, comprising:

an insulating encapsulation comprising a first portion and a second portion stacked on the first portion;
at least one semiconductor die encapsulated in the first portion of the insulating encapsulation;
first antennas electrically connected to the at least one semiconductor die, wherein a portion of each of the first antennas is encapsulated in the first portion of the insulating encapsulation, and another portion of each of the first antennas is encapsulated in the second portion of the insulating encapsulation;
and
second antennas electrically connected to the at least one semiconductor die, wherein a portion of each of the second antennas is encapsulated in the first portion of the insulating encapsulation, and another portion of each of the second antenna is encapsulated in the second portion of the insulating encapsulation.

2 more elements

A package structure, comprising:

an insulating encapsulation;
a first redistribution structure located on the insulating encapsulation;
at least one semiconductor die encapsulated in the insulating encapsulation and electrically connected to the first redistribution structure;
first antennas electrically connected to the at least one semiconductor die, wherein a first group of the first antennas is encapsulated in the insulating encapsulation and a second group of the first antennas is located in the first redistribution structure;
and
second antennas electrically connected to the at least one semiconductor die, wherein a first group of the second antennas is encapsulated in the insulating encapsulation and a second group of the second antennas is located in the first redistribution structure.

3 more elements

Dependencies are inferred from the claim text.

Package structure

Life of this patent

Package structure

Life of this patent

Abstract

Claims20