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US 2019/0103577 A1Published application
Method of forming transparent correlated metal electrode
AssigneeKonica Minolta Laboratory U.S.A., Inc.
InventorJun Amano
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Abstract
A method of fabricating a flexible transparent conductive electrode layer includes depositing a correlated metal film having a thickness between 10 nm and 100 nm on a flexible transparent substrate, annealing the correlated metal film with the UV pulses, and maintaining a temperature of the flexible transparent substrate below 80° C. during the depositing and annealing.
Claims17
A method of fabricating a flexible transparent conductive electrode layer, comprising:
- depositing a correlated metal film having a thickness between 10 nm and 100 nm on a flexible transparent substrate;
- annealing the correlated metal film with UV pulses;
- and
- maintaining a temperature of the flexible transparent substrate below 80° C. during the depositing and annealing.
1 more element
A device comprising:
- an annealed, correlated metal film having a thickness between 10 nm and 100 nm on a flexible transparent substrate,
- wherein the correlated metal film is annealed using UV pulses while maintaining a temperature of the flexible transparent substrate below 80° C. , and
- wherein the correlated metal film and flexible transparent substrate include a plurality of areas each having different predetermined shapes and different predetermined sheet resistances.
Dependencies are inferred from the claim text.