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US 2019/0103542 A1Published application
Two-component bump metallization
AssigneeInternational Business Machines Corporation
InventorsDavid W. Abraham, John M. Cotte, Eric P. Lewandowski
Life of this patent
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Abstract
A technique relates to a structure. An under-bump-metallization (UBM) structure includes a first region and a second region. The first and second regions are laterally positioned in the UBM structure. The first region includes a superconducting material. A substrate opposes the UBM structure. A superconducting solder material joins the first region to the substrate and the second region to the substrate.
Claims25
A structure comprising:
- an under-bump-metallization (UBM) structure comprising a first region and a second region, the first and second regions being laterally positioned in the UBM structure, wherein the first region comprises a superconducting material;
- a substrate opposing the UBM structure;
- and
- a superconducting solder material joining the first region to the substrate and the second region to the substrate.
1 more element
A structure comprising:
- a first under-bump-metallization (UBM) structure comprising a first region and a second region, the first and second regions being laterally positioned in the first UBM structure, the first UBM structure being connected to a first substrate;
- a second UBM structure comprising another first region and another second region, the another first and another second regions being laterally positioned in the second UBM structure, the second UBM structure being connected to a second substrate;
- and
- a superconducting solder material joining the first region and the second region of the first UBM structure to the another first region and the another second region of the second UBM structure, wherein the first region and the another first region comprise superconducting material.
1 more element
A system comprising:
- a device comprising:
- an under-bump-metallization (UBM) structure comprising a first region and a second region, the first and second regions being laterally positioned in the UBM structure, wherein the first region comprises a superconducting material;
- a substrate opposing the UBM structure;
- and
- a superconducting solder material joining the first region to the substrate and the second region to the substrate;
- and
- a cooling system configured to reduce a temperature to a superconducting temperature associated with the device.
4 more elements
A method of forming a device, the method comprising:
- providing an under-bump-metallization (UBM) structure comprising a first region and a second region, the first and second regions being laterally positioned in the UBM structure, wherein the first region comprises a superconducting material;
- providing a substrate opposing the UBM structure;
- and
- joining the substrate to the first region and to the second region with a superconducting solder material.
1 more element
A method of forming a device, the method comprising:
- providing a first under-bump-metallization (UBM) structure comprising a first region and a second region, the first and second regions being laterally positioned in the first UBM structure, the first UBM structure being connected to a first substrate;
- providing a second UBM structure comprising another first region and another second region, the another first and another second regions being laterally positioned in the second UBM structure, the second UBM structure being connected to a second substrate;
- and
- joining the first region and the second region of the first UBM structure to the another first region and the another second region of the second UBM structure with a superconducting solder material joining, wherein the first region and the another first region comprise superconducting material.
1 more element
Dependencies are inferred from the claim text.