Bump bonded cryogenic chip carrier

A device comprising:

• a first plurality of thin films in physical contact with a first substrate at a first superconducting region, the first plurality of thin films characterized by having a first opposing surface and a first connection surface, wherein the first connection surface is in the physical contact with the first superconducting region;
• a second plurality of thin films in physical contact with a second substrate at a second superconducting region, the second plurality of thin films characterized by having a second opposing surface and a second connection surface, the first and second opposing surfaces being opposite one another, wherein the second connection surface is in the physical contact with the second superconducting region;
• and
• a solder material electrically connecting the first and second opposing surfaces, the solder material characterized by maintaining a low ohmic electrical contact between the first and second opposing surfaces at temperatures below 100 degrees Kelvin, wherein the first and second superconducting regions are comprised of materials that have a melting point of at least 700 degrees Celsius.

A system comprising:

• a cooling system;
• a device in the cooling system, the device comprising:
• a first plurality of thin films, the first plurality of thin films characterized by having a first opposing surface and a first connection surface, wherein the first connection surface is in physical contact with a first superconducting region;
• a second plurality of thin films, the second plurality of thin films characterized by having a second opposing surface and a second connection surface, the first and second opposing surfaces being opposite one another, wherein the second connection surface is in physical contact with a second superconducting region;
• and
• a solder material electrically connecting the first and second opposing surfaces, the solder material characterized by maintaining a low ohmic electrical contact between the first and second opposing surfaces at temperatures below 100 degrees Kelvin, wherein the first and second superconducting regions are comprised of materials that have a melting point of at least 700 degrees Celsius.

A method of configuring a device, the method comprising:

• forming a first plurality of thin films, the first plurality of thin films characterized by having a first opposing surface and a first connection surface, wherein the first connection surface is in physical contact with a first superconducting region;
• forming second plurality of thin films, the second plurality of thin films characterized by having a second opposing surface and a second connection surface, the first and second opposing surfaces being opposite one another, wherein the second connection surface is in physical contact with a second superconducting region;
• and
• joining the first and second opposing surfaces with a solder material such that the solder material electrically connects the first and second opposing surfaces, the solder material characterized by maintaining a low ohmic electrical contact between the first and second opposing surfaces at temperatures below 100 degrees Kelvin, wherein the first and second superconducting regions are comprised of materials that have a melting point of at least 700 degrees Celsius.