Metal-ceramic composite lead frame structure, manufacturing method thereof, and led using the same structure
OwnerYi-Jhen Leeinventor
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Abstract
The present invention provides a metal-ceramic lead frame structure, a manufacturing method thereof, and a LED by using the same structure. The metal-ceramic lead frame structure of the present invention includes a substrate. The substrate comprises a metal base layer and a ceramic layer provided on an exterior of the metal base layer, and the substrate has a plurality of chip carriers integrally formed with the substrate by machining the substrate.
Claims15
A metal-ceramic composite lead frame structure, comprising a substrate, wherein the substrate comprises a metal base layer and a ceramic layer provided on an exterior of the metal base layer, and the substrate has a plurality of chip carriers integrally formed with the substrate by machining the substrate.
A method for manufacturing a metal-ceramic composite strip lead frame, including the steps of:
- providing a metal base layer;
- forming a ceramic layer on the surface of the metal base layer;
- and,
- stamping the metal base layer to form an array of protruding units, wherein the protruding units surround and form a plurality of closed spaces there between, and the closed spaces serve respectively as chip carriers and are to be filled with an encapsulant.
Dependencies are inferred from the claim text.