Laminating structure of electronic device using transferring element, transferring apparatus for fabricating the electronic device and method for fabricating the electronic device

A method for fabricating an electronic device using a transferring element comprising:

• preparing a mother wafer;
• forming an inorganic material-based multilayer thin film layer which makes up an electronic device on the mother wafer;
• individually isolating the electronic device formed on the multilayer thin film layer;
• attaching a carrier substrate to the electronic device;
• removing the mother wafer;
• aligning positions of a bottom electrode formed on a target substrate and the electronic device on the carrier substrate;
• placing a transferring element between the target substrate and the electronic device, and performing transfer and interconnection;
• removing the carrier substrate;
• and
• forming a top electrode connected to the electronic device after the removing of the carrier substrate.