Method for manufacturing package, and method for manufacturing light emitting device

A method for manufacturing a light emitting device comprising

• molding a precursor of a package including
• a cup-shaped resin component having a bottom surface and side walls that surround the bottom surface, an opening which is opened at an upper part of the side walls, and
• a pair of leads exposed on part of the bottom surface,
• the resin component having a 3-D shape defined by a n X axis, a Y axis that is perpendicular to the X axis and a Z axis that is perpendicular to the X and Y axes,
• the opening of the upper part of the side walls extending in the X axis direction and the Z axis direction, and being longer in the X axis direction than in the Z axis direction,
• the side walls including at least one side wall that extends along the Y axis and the X axis and that has a first outer surface,
• and at least one side wall that extends along the Y axis and the Z axis,
• a thickness of the at least one side wall extending along Y axis and the X axis being less than a thickness of the at least one side wall extending along V axis and the Z axis, and
• the first outer surface of the at least one side wall extending along the Y axis and the X axis having a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening,
• mounting a light emitting element on the pair of leads on the bottom surface;
• and
• forming a reflective film in the recess.