Packaging frame and manufacturing method of packaging frame

A packaging frame configured for securing a photoelectric device chip, the packaging frame comprising:

• a substrate;
• a metal layer, disposed on the substrate;
• wherein the metal layer comprises a positive section and a negative section spaced apart;
• and
• a reflector, disposed on the substrate and the metal layer;
• wherein the reflector is formed with a through hole to define regions where the metal layer and the substrate are located in the through hole as a die bonding region, the reflector is connected with the substrate by a connector, and the connector is made of geological polymer.

A preparing method of a geological polymer applicable for a packaging frame, comprising:

• providing mixed powders whose principal raw materials are mineral powders with silicon oxygen tetrahedron and aluminum oxygen tetrahedron;
• adding an alkali activator into the mixed powders to form a slurry with fluidic and thixotropic properties;
• and
• disposing the slurry in a predetermined position of the packaging frame to react and solidify and thereby forming the geological polymer;
• wherein the packaging frame is configured for securing a photoelectric device chip and comprises:
• a lead frame comprising a positive electrode pad and a negative electrode pad;
• an insulator disposed between the positive electrode pad and the negative electrode pad;
• and
• a reflector disposed on the lead frame and the insulator, the reflector being formed with a through hole to define regions where the lead frame and the insulator are located in the through hole as a die bonding region, the reflector being connected with the lead frame by a connector, and the connector being made of the geological polymer;
• or, wherein the packaging frame is configured for securing a photoelectric device chip and comprises:
• a substrate;
• a metal layer disposed on the substrate and comprising a positive section and a negative section spaced apart;
• and
• a reflector disposed on the substrate and the metal layer, the reflector being formed with, a through hole to define regions where the metal layer and the substrate are located in the through hole as a die bonding region, the reflector being connected with the substrate by a connector, and the connector being made of the geological polymer.