Optical semiconductor apparatus
AssigneeHoya Candeo Optronics Corporation
InventorsYasuo KOGURE, Shinichi OGAWA, Satoshi YAJIMA
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Abstract
Provided is an optical semiconductor apparatus having an optical semiconductor device, a light-permeable buffer layer containing a cured high-hardness silicone resin having a thickness of 1-300 μm, which covers at least part of a light-emitting surface of the optical semiconductor device, and a flexible sealing layer containing a cured flexible silicone resin having a lower hardness than the light-permeable buffer layer, which covers the optical semiconductor device and the light-permeable buffer layer.
Claims19
An optical semiconductor apparatus having an optical semiconductor device, a light-permeable buffer layer comprising a cured high-hardness silicone resin having a thickness of 1-300 μm, which covers at least part of a light-emitting surface of the optical semiconductor device, and a flexible sealing layer comprising a cured flexible silicone resin having a lower hardness than the light-permeable buffer layer, which covers the optical semiconductor device and the light-permeable buffer layer.
Dependencies are inferred from the claim text.