Glass wiring substrate, method of producing the same, part-mounted glass wiring substrate, method of producing the same, and display apparatus substrate

A method of producing a part-mounted glass wiring substrate, comprising:

• preparing a glass substrate, a first wiring portion being formed on a first surface of the glass substrate, no wiring portion being formed on a second surface opposite to the first surface;
• forming, in the glass substrate, a through-hole from a second surface side, the through-hole being in a region in which the first wiring portion is not formed, the through-hole having a diameter on the second surface side larger than a diameter on a first surface side;
• then,
• forming a through-hole portion from inside of the through-hole to the first wiring portion, and forming, on the second surface, a second wiring portion extending from the through-hole portion;
• and then,
• mounting an electronic part on the first wiring portion.

A glass wiring substrate, comprising:

• a glass substrate, a first wiring portion being formed on a first surface of the glass substrate, a second wiring portion being formed on a second surface opposite to the first surface;
• a through-hole formed in a region of the glass substrate in which the first wiring portion and the second wiring portion are not formed, the through-hole having a diameter on a second surface side larger than a diameter on a first surface side;
• and
• a through-hole portion formed in the through-hole, one end portion of the through-hole portion extending to the first wiring portion, the other end portion of the through-hole portion extending to the second wiring portion, wherein
• a wiring pitch P1 of the first wiring portion in the vicinity of the through-hole portion is narrower than a wiring pitch P2 of the second wiring portion in the vicinity of the through-hole portion.

A part-mounted glass wiring substrate, comprising:

• a glass substrate, a first wiring portion being formed on a first surface of the glass substrate, a second wiring portion being formed on a second surface opposite to the first surface;
• a through-hole formed in a region of the glass substrate in which the first wiring portion and the second wiring portion are not formed, the through-hole having a diameter on a second surface side larger than a diameter on a first surface side;
• a through-hole portion formed in the through-hole, one end portion of the through-hole portion extending to the first wiring portion, the other end portion of the through-hole portion extending to the second wiring portion;
• and
• an electronic part mounted on the first wiring portion, wherein
• a wiring pitch P1 of the first wiring portion in the vicinity of the through-hole portion is narrower than a wiring pitch P2 of the second wiring portion in the vicinity of the through-hole portion.

A display apparatus substrate, comprising:

• a glass substrate, a first wiring portion being formed on a first surface of the glass substrate, a second wiring portion being formed on a second surface opposite to the first surface;
• a through-hole formed in a region of the glass substrate in which the first wiring portion and the second wiring portion are not formed, the through-hole having a diameter on a second surface side larger than a diameter on a first surface side;
• a through-hole portion formed in the through-hole, one end portion of the through-hole portion extending to the first wiring portion, the other end portion of the through-hole portion extending to the second wiring portion;
• and
• an electronic part mounted on the first wiring portion, wherein
• a wiring pitch P1 of the first wiring portion in the vicinity of the through-hole portion is narrower than a wiring pitch P2 of the second wiring portion in the vicinity of the through-hole portion,
• the electronic part includes a plurality of light-emitting devices and a driving semiconductor apparatus driving the plurality of light-emitting devices,
• the driving semiconductor apparatus is mounted on a driving semiconductor device mounting portion provided on the first wiring portion, and connected from the driving semiconductor device mounting portion to the second wiring portion via the through-hole portion, and
• each of the plurality of light-emitting devices is mounted on a light-emitting device mounting portion provided on the first wiring portion, and connected to the driving semiconductor apparatus via the first wiring portion.