Silicon carbide semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorShinichiro MATSUNAGA
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AssigneeFuji Electric Co., Ltd.
InventorShinichiro MATSUNAGA
Estimating the term…
For example, a pin diode is constituted by a silicon carbide epitaxial substrate in which silicon carbide epitaxial layers constituting an n-type buffer region, an n−-type drift region, and a p++-type anode region are sequentially formed by epitaxial growth on a front surface of an n+-type silicon carbide substrate. The n−-type drift region has an n-type impurity concentration is, for example, about 1×1014/cm3 to 1×1016/cm3. The n−-type drift region has a boron concentration that is substantially lower than an n-type impurity concentration of the n−-type drift region and that, for example, is about 1×1014/cm3 or less. During epitaxial growth of the n−-type drift region, automatic doping of boron to the n−-type drift region is suppressed, whereby the boron concentration of the n−-type drift region is reduced and the n−-type drift region in which no traps are present is formed.
A silicon carbide semiconductor device comprising:
Dependencies are inferred from the claim text.