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US 2019/0103444 A1Published application
Stacked Transparent Pixel Structures for Image Sensors
AssigneeLockheed Martin Corporation
InventorMark A. Lamkin
Life of this patent
Estimating the term…
Abstract
In one embodiment, a pixel for an image sensor includes a first subpixel and a second subpixel stacked on top of the first subpixel. Each of the first and second subpixels include a polygon shape. Each of the first and second subpixels include a photodetector layer, a transparent cathode layer, and a transparent anode layer.
Claims20
A system comprising:
- a substrate;
- a plurality of hexagon-shaped pixels coupled to the substrate, each hexagon-shaped pixel comprising:
- a first subpixel formed on the substrate;
- a second subpixel stacked on top of the first subpixel;
- and
- a third subpixel stacked on top of the second subpixel;
- and
- a plurality of connector columns that electrically couple the first, second, and third subpixels to the substrate;
- wherein:
- each of the first, second, and third subpixels comprises a photodetector layer located between a transparent cathode layer and a transparent anode layer;
- and
- each transparent cathode layer and transparent anode layer of each subpixel is electrically coupled to the substrate through a respective one of the plurality of connector columns.
9 more elements
A pixel for an image sensor, the pixel comprising:
- a first subpixel;
- and
- a second subpixel stacked on top of the first subpixel;
- wherein:
- each of the first and second subpixels comprises a polygon shape;
- and
- each of the first and second subpixels comprises a photodetector layer, a transparent cathode layer, and a transparent anode layer.
4 more elements
A method of manufacturing a pixel for an image sensor, the method comprising:
- creating a first subpixel by:
- performing a first step of creating a transparent insulating layer by depositing a layer of transparent insulating material and then patterning the layer of transparent insulating material using lithography;
- performing a second step of creating a transparent cathode layer of a subpixel by depositing a layer of transparent conductive material on the patterned transparent insulating layer and then patterning the transparent cathode layer using lithography, wherein patterning the transparent cathode layer comprises forming a portion of the transparent cathode layer into a polygon shape;
- performing a third step of creating a photodetector layer of the subpixel by depositing a layer of photodetecting material on the patterned transparent cathode layer and then patterning the photodetector layer using lithography, wherein patterning the photodetector layer comprises forming a portion of the photodetector layer into the polygon shape;
- and
- performing a fourth step of creating a transparent anode layer of the subpixel by depositing a layer of transparent anode material on the patterned photodetector layer and then patterning the transparent anode layer using lithography, wherein patterning the transparent anode layer comprises forming a portion of the transparent anode layer into the polygon shape;
- and
- creating a second subpixel on top of the first subpixel by repeating the first, second, third, and fourth steps.
5 more elements
Dependencies are inferred from the claim text.