Sensor Package and Method of Manufacturing the Same

A method of manufacturing a sensor package, comprising:

• providing a panel type carrier and a release film disposed on the panel type carrier;
• providing a plurality of sensors, each of the sensors comprising at least one side surface, a back surface and an active surface, each of the active surfaces comprising a sensing area and a plurality of electric pads;
• fixing the sensors onto the panel type carrier by utilizing the release film, with the active surfaces of the sensors toward the panel type carrier;
• forming an encapsulation layer to cover the release film, the side surfaces of the sensors and the back surfaces of the sensors, the encapsulation layer comprising a first surface contacting the release film and a second surface opposite to the first surface;
• performing a drilling process to form a plurality of via holes disposed around the sensors and passing through the encapsulation layer, wherein a cross section of each of the via holes at the first surface of the encapsulation layer has a first diameter, and a cross section of each of the via holes at the second surface of the encapsulation layer has a second diameter, and the first diameter is less than the second diameter;
• filling the via holes to form a plurality of via plugs in the via holes, the via plugs extending from the second surface of the encapsulation layer to the first surface of the encapsulation layer;
• removing the release film and the panel type carrier from the sensors and the encapsulation layer;
• forming a first redistribution layer disposed on the via plugs and the electric pads of the sensors, the first redistribution layer electrically connecting the electric pads of the sensors and the via plugs;
• forming a photo-imageable dielectric (PID) layer covering the first redistribution layer and the first surface of the encapsulation layer;
• and
• performing a dicing process to cut the PID layer and the encapsulation layer, so to separate the sensors from each other.