Image sensing apparatus and manufacturing method thereof

A method of manufacturing an image sensing apparatus, the method comprising:

• forming a first substrate structure including a photoelectric conversion element in a pixel region, the first substrate structure having a first surface and a second surface opposite the first surface;
• forming a second substrate structure including a circuit region for driving the pixel region, the second substrate structure having a third surface and a fourth surface opposite the third surface;
• bonding the first substrate structure to the second substrate structure, such that the first surface of the first substrate structure is connected to the third surface of the second substrate structure;
• forming a color filter and a microlens of the pixel region on the second surface of the first substrate structure;
• and
• mounting semiconductor chips on the fourth surface of the second substrate structure, using a conductive bump.

A method of manufacturing an image sensing apparatus, the method comprising:

• forming a stack structure of a first substrate structure and a second substrate structure, the first substrate structure including a pixel region, and the second substrate structure including a circuit region for driving the pixel region;
• bonding a carrier substrate to one surface of the first substrate structure;
• removing a portion of the second substrate structure from one surface of the second substrate structure;
• forming a redistribution layer and a conductive connection pad disposed on the redistribution layer, on the one surface of the second substrate structure;
• connecting semiconductor chips on the one surface of the second substrate structure, using a conductive bump;
• forming an encapsulation portion encapsulating the semiconductor chips;
• removing the carrier substrate from the one surface of the first substrate structure;
• and
• separating a stack structure of the first substrate structure, the second substrate structure, and the semiconductor chips into unit image sensing apparatuses.