Display device and method for manufacturing display device
AssigneeJapan Display Inc.
InventorHiroki NAKAIE
Life of this patent
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Abstract
A display device includes a resin substrate including a through hole in a terminal area around a display area in which an image is displayed, a circuit layer including a thin film transistor and disposed in the display area on the resin substrate, a wire extending from the circuit layer and formed inside of the through hole, and an IC driver disposed on a side of the resin substrate opposite to a side on which the circuit layer is disposed. The IC driver includes a terminal that protrudes into the through hole and is in contact with the wire formed inside of the through hole such that the IC driver and the circuit layer are electrically connected to each other.
Claims5
A display device comprising:
- a resin substrate including a through hole in a terminal area around a display area in which an image is displayed;
- a circuit layer including a thin film transistor and disposed in the display area on the resin substrate;
- a wire extending from the circuit layer and formed inside of the through hole;
- and
- an electronic component disposed on a side of the resin substrate opposite to a side on which the circuit layer is disposed, wherein
- the electronic component includes a terminal that protrudes into the through hole and is in contact with the wire formed inside of the through hole such that the electronic component and the circuit layer are electrically connected to each other.
A method for manufacturing a display device comprising:
- preparing a resin substrate;
- forming a hole in a terminal area of a display area of the resin substrate, an image being displayed in the display area,
- disposing a circuit layer on the display area of the resin substrate;
- forming a wire inside of the hole, the wire extending from the circuit layer;
- and
- disposing an electronic component on a side of the resin substrate opposite to a side on which the circuit layer is disposed, wherein
- in the step of disposing the electronic component, a terminal included in the electronic component is stuck in the hole from a side of the resin substrate opposite to a side in which the hole is formed, thereby forming a through hole such that the terminal is in contact with the wire.
Dependencies are inferred from the claim text.