Esd protection circuit and method of making the same
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsYohann Frederic Michel SOLARO, Chai Ean GILL, Tsung-Che TSAI
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Abstract
Methods of forming a high voltage ESD GGNMOS using embedded gradual PN junction in the source region and the resulting devices are provided. Embodiments include a device having a substrate including a device region with an ESD protection circuit; a gate over the device region; a source region in the device region having a N+ implant and a P+ implant laterally separated on a first side of the gate; and a drain region in the device region on a second side of the gate, opposite the first.
Claims20
A device comprising:
- a substrate including a device region with an electrostatic discharge (ESD) protection circuit;
- a gate over the device region;
- a source region in the device region having a n-type (N+) implant and a p-type (P+) implant laterally separated on a first side of the gate;
- a drain region in the device region on a second side of the gate, opposite the first;
- another N+ implant, wherein an edge of each N+ implant is aligned with an opposite edge of the source region and the P+ implant is laterally separated therebetween;
- and
- a low-voltage p-well (LVPW) formed in the device region prior to a formation of each of the N+ and P+ implants and wherein the N+ and P+ implants and a portion of the another N+ implant are in the LVPW.
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A method comprising:
- providing a substrate having a device region with an electrostatic discharge (ESD) protection circuit;
- forming a gate over the device region;
- forming a source region in the device region having a n-type (N+) implant and a p-type (P+) implant laterally separated on a first side of the gate;
- and
- forming a drain region in the device region on a second side of the gate, opposite the first.
A device comprising:
- a substrate including a device region with an electrostatic discharge (ESD) protection circuit;
- a gate over the device region;
- a source region having an embedded n-type (N+) implant on opposite sides of the source region and a p-type (P+) implant in the device region under a grounded pad on a first side of the gate, wherein the P+ implant is separated from each N+ region by 80 nm to 100 nm;
- a N+ drain region in the device region on a second side of the gate, opposite the first;
- another N+ implant, wherein an edge of each N+ implant is aligned with an opposite edge of the source region and the P+ implant is laterally separated therebetween;
- and
- a low-voltage p-well (LVPW) formed in the device region prior to a formation of each of the N+ and P+ implants and wherein the N+ and P+ implants and a portion of the another N+ implant are in the LVPW.
Dependencies are inferred from the claim text.