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US 2019/0103391 A1Published application
Semiconductor Device and Method of Manufacturing
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJui Hsieh Lai, Ying-Hao Kuo, Kuo-Chung Yee
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Abstract
A semiconductor device includes a first chip, a dielectric layer over the first chip, and a second chip over the dielectric layer. A conductive layer is embedded in the dielectric layer and is electrically coupled to the first chip and the second chip. The second chip includes an optical component. The first chip and the second chip are arranged on opposite sides of the dielectric layer in a thickness direction of the dielectric layer.
Claims20
A method comprising:
- encapsulating a first chip in an encapsulant;
- forming a redistribution layer over the encapsulant and the first chip, the redistribution layer being electrically coupling to the first chip;
- forming a waveguide over the encapsulant;
- forming a conductive feature over and electrically coupling to a portion of the redistribution layer;
- and
- bonding a second chip to the conductive feature, wherein the second chip comprises an optical component in optical alignment with the waveguide.
3 more elements
A method comprising:
- placing a first chip and a second chip over a carrier;
- encapsulating the first chip and the second chip in a encapsulant;
- forming a first dielectric layer over and contacting the first chip, the second chip, and the encapsulant;
- patterning the first dielectric layer to form a first opening, a second opening, and a third opening, wherein a first contact pad of the first chip and a second contact pad of the second chip are exposed to the first opening and the second opening, respectively;
- forming a conductive layer comprising:
- first portions over the first dielectric layer;
- second portions extending into the first opening and the second opening to electrically couple to the first contact pad and the second contact pad, respectively;
- and
- a third portion extending into the third opening;
- forming a waveguide over the encapsulant and extending into the third opening;
- and
- bonding a second chip electrically coupling to the conductive layer, and the second chip comprises an optical component optically coupling to the waveguide through the third portion of the conductive layer.
9 more elements
A method comprising:
- encapsulating an electrical chip in an encapsulant;
- forming a first dielectric layer over the electrical chip and the encapsulant;
- forming an opening in the first dielectric layer, wherein a portion of the first dielectric layer facing the opening has a slanted sidewall;
- forming a waveguide and a mirror in the opening, wherein the mirror is on the slanted sidewall;
- and
- bonding an optical chip over the mirror, wherein the optical chip comprises an optical component optically coupling to the waveguide through the mirror.
3 more elements
Dependencies are inferred from the claim text.