Pop device and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih
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Abstract
Provided are a PoP device and a method of manufacturing the same. The PoP device includes a first package structure and a second package structure. The first package structure includes a die, a through integrated fan-out via (TIV), an encapsulant, and a film. The TIV is aside the die. The encapsulant encapsulates sidewalls of the die and sidewalls of the TIV. The film is over the TIV and the encapsulant, and aside the die. The second package structure is connected to the first package structure through a connector. The connector penetrates through the film to electrically connected to the TIV.
Claims20
A package-on-package (PoP) device, comprising:
- a first package structure, comprising:
- a die;
- a through integrated fan-out via (TIV) aside the die;
- an encapsulant encapsulating sidewalls of the die and sidewalls of the TIV;
- and
- a film over the TIV and the encapsulant, and aside the die;
- and
- a second package structure, connected to the first package structure through a connector,
- wherein the connector penetrates through the film to electrically connected to the TIV,.
- wherein the film is surrounded by the encapsulant.
(withdrawn and currently amended) A PoP device, comprising:
- a first package structure, comprising:
- a die;
- a TIV aside the die;
- an encapsulant aside the die and the TIV, encapsulating sidewalls of the die and sidewalls of the TIV;
- a film, over the TIV and aside the die, and surrounded by the encapsulant;
- and
- a conductive terminal, electrically connected to the die and the TIV through a redistribution layer (RDL) structure;
- and
- a second package structure electrically connected to the first package structure though a connector, wherein the connector is in electrical contact with a top surface of the TIV,
- wherein a portion of the connector is aside the die, and a bottom surface of the connector is lower than a top surface of the die.
(withdrawn and currently amended) A method of manufacturing a PoP device, comprising:
- forming a first package structure, comprising:
- forming a film and attaching a die on a carrier, wherein the film is disposed aside the die;
- forming a TIV on the film and aside the die;
- forming an encapsulant aside the die, the TIV and the film, and on the film, encapsulating sidewalls of the die and sidewalls of the TIV;
- releasing the carrier;
- and
- removing a portion of the film, and forming a recess in the film, the recess exposes a top surface of the TIV;
- and
- electrically connecting a second package structure to the first package structure though a connector,
- wherein the connector fills in the recess of the film to be in electrical contact with the
- wherein the film is surrounded by the encapsulant.
Dependencies are inferred from the claim text.