US 2019/0103385 A1 · THERMALLY COUPLED PACKAGE-ON-PACKAGE SEMICONDUCTOR

Abstract

The present disclosure is directed to systems and methods for improving heat distribution and heat removal efficiency in PoP semiconductor packages. A PoP semiconductor package includes a first semiconductor package that is physically, communicably, and conductively coupled to a stacked second semiconductor package. A thermally conductive member that includes at least one thermally conductive member may be disposed between the first semiconductor package and the second semiconductor package. The thermally conductive member may include: a single thermally conductive element; multiple thermally conductive elements; or a core that includes at least one thermally conductive element. The thermally conductive elements are thermally conductively coupled to an upper surface of the first semiconductor package and to the lower surface of the second semiconductor package to facilitate the transfer of heat from the first semiconductor package to the second semiconductor package.

Claims25

Dependent claims

A package-on-package (PoP) semiconductor package comprising:

a first semiconductor package having an upper surface and a lower surface;
a second semiconductor package having an upper surface and a lower surface;
and
a thermally conductive member disposed between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package, the thermally conductive member including at least one continuous metallic, thermally conductive pathway between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package.

1 more element

A package-on-package (PoP) semiconductor package fabrication method, comprising:

disposing a thermally conductive member between an upper surface of a first semiconductor package and a lower surface of a second semiconductor package;
wherein the thermally conductive member includes at least one continuous metallic, thermally conductive, member;
physically coupling the thermally conductive member to the upper surface of the first semiconductor package and the lower surface of the second semiconductor package;
and
thermally conductively coupling the thermally conductive member to the upper surface of the first semiconductor package and the lower surface of the second semiconductor package.

2 more elements

A package-on-package (PoP) semiconductor package fabrication system, comprising:

means for disposing a thermally conductive member between an upper surface of a first semiconductor package and a lower surface of a second semiconductor package;
wherein the thermally conductive member includes at least one continuous metallic, thermally conductive, member;
means for physically coupling the thermally conductive member to the upper surface of the first semiconductor package and the lower surface of the second semiconductor package;
and
means for thermally conductively coupling the thermally conductive member to the upper surface of the first semiconductor package and the lower surface of the second semiconductor package.

2 more elements

Dependencies are inferred from the claim text.

Thermally coupled package-on-package semiconductor

Life of this patent

Thermally coupled package-on-package semiconductor

Life of this patent

Abstract

Claims25