Method of manufacturing multi-chip package

A method of manufacturing a multi-chip package, the method comprising:

• stacking a first group of semiconductor chips on a package substrate including a first substrate pad;
• forming first stud bumps on bonding pads of the first group of semiconductor chips except for a lowermost semiconductor chip in the first group of semiconductor chips;
• downwardly extending a first conductive wire from a bonding pad of the lowermost semiconductor chip in the first group of semiconductor chips to connect the first conductive wire with the first substrate pad;
• and
• upwardly extending a second conductive wire from the bonding pad of the lowermost semiconductor chip in the first group of semiconductor chips to sequentially connect the second conductive wire with the first stud bumps,
• wherein the second conductive wire is a single wire continuously extending from the lowermost semiconductor chip to the first stud bumps in a steplike shape.