Methods of forming joint structures for surface mount packages
AssigneeIntel Corporation
InventorsLilia May, Edward R. Prack
Life of this patent
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Abstract
Methods/structures of joining package structures are described. Those methods/structures may include forming a metal formate on a surface of a first solder interconnect structure disposed on a first package substrate at a first temperature, and attaching a second solder interconnect structure disposed on a second package substrate to the first solder interconnect structure at a second temperature. The second temperature decomposes at least a portion of the metal formate and generates a hydrogen gas. The generated hydrogen gas removes an oxide from the second solder interconnect structure during joint formation at the second temperature.
Claims25
A microelectronic package structure comprising:
- a first package comprising a first substrate;
- a first die disposed on the first substrate;
- a first solder ball disposed on the first substrate adjacent the first die;
- a second package comprising a second substrate, wherein the second substrate comprises a first side and a second side;
- a second die disposed on the first side of the second substrate;
- and
- a second solder ball adjacent the second die;
- wherein at least one of a surface of the first solder ball or a surface of the second solder ball comprises a formate coating.
A method of forming a microelectronic package assembly comprising:
- forming a metal formate coating on a surface of a first solder ball, wherein the first solder ball is disposed on a first package substrate, and wherein the first solder ball is adjacent a die on a first side of the first package substrate;
- attaching the first package substrate to a second package substrate by using an attachment process, wherein a second solder ball is disposed on a first side of the second substrate, and wherein the attachment process produces hydrogen gas by the decomposition of the metal formate at the attachment process temperature;
- and
- reacting a metal oxide disposed on a surface of the second solder ball with the hydrogen gas.
A method of forming a microelectronic package structure, comprising:
- forming a metal formate on a surface of a first solder interconnect structure disposed on a first package substrate at a first temperature;
- attaching a second solder interconnect structure disposed on a second package substrate to the first solder interconnect structure at a second temperature, wherein the second temperature decomposes at least a portion of the metal formate and generates a hydrogen gas;
- and
- reacting a metal oxide disposed on the second solder interconnect structure with the hydrogen gas.
Dependencies are inferred from the claim text.