Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semiconductor Chip Including the Jig, and Method of Bonding a Semiconductor Chip Using the Apparatus

Abstract

A jig for bonding a semiconductor chip may include a pressurizing portion and at least one opening. The pressuring portion may be configured to pressurize an upper surface of the semiconductor chip bonded to a package substrate via a bump and a flux using a laser. The opening may be surrounded by the pressurizing portion. The laser irradiated to the bump and the flux may be transmitted through the opening. A vapor generated from the flux by the laser may be discharged through the opening. Thus, the contamination of the jig caused by the vapor may be prevented so that a transmissivity of the laser through the jig may be maintained.

Dependencies are inferred from the claim text.