Land grid array patterns for modular electronics platforms and methods of performing the same
AssigneeHand Held Products, Inc.
InventorsBruce Morton, Pavel Nikitin, David Gilpin
Life of this patent
Estimating the term…
Abstract
Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).
Claims20
An apparatus for providing a modular electronics platform for a mobile computing device, the apparatus comprising:
- a system on module (SOM) comprising a first surface and a second surface opposite the first surface, wherein the first surface is configured to be coupled electrically to one or more chipsets;
- a land grid array (LGA) disposed on the second surface of the SOM, wherein the LGA comprises:
- one or more center anchor pads disposed on the second surface of the SOM, one or more corner anchor pads disposed on the second surface of the SOM, a digital signal array disposed on the second surface of the SOM, one or more communications pads disposed on the second surface of the SOM, and one or more ground pads disposed on the second surface of the SOM.
A system for providing a modular electronics platform for a mobile computing device, the system comprising:
- a system on module (SOM) comprising a first SOM surface and a second SOM surface opposite the first SOM surface, wherein the first SOM surface is configured to be coupled electrically to one or more chipsets;
- a land grid array (LGA) disposed on the second SOM surface, wherein the LGA comprises one or more LGA center anchor pads disposed on the second SOM surface, one or more LGA corner anchor pads disposed on the second SOM surface, one or more LGA digital signal pads disposed on the second SOM surface, one or more LGA communications pads disposed on the second SOM surface, one or more LGA ground pads disposed on the second SOM surface;
- and
- a main logic board (MLB) comprising:
- an MLB surface,
- one or more MLB center anchor pads disposed on the MLB surface and configured to be coupled to the one or more LGA center anchor pads,
- one or more MLB corner anchor pads disposed on the MLB surface and configured to be coupled to the one or more LGA corner anchor pads,
- one or more MLB digital signal pads disposed on the MLB surface and configured to be coupled to the one or more LGA digital signal pads,
- one or more MLB communications pads disposed on the MLB surface and configured to be coupled to the one or more LGA communications pads, and
- one or more MLB ground pads disposed on the MLB surface and configured to be coupled to the one or more LGA ground pads.
A method of manufacturing a main logic board (MLB), the method comprising:
- forming one or more MLB center anchor pads on a first surface of the MLB, wherein the one or more MLB center anchor pads are configured to be coupled to one or more land grid array (LGA) center anchor pads disposed on a second surface of a system on module (SOM);
- forming one or more MLB corner anchor pads on the first surface of the MLB, wherein the one or more MLB corner anchor pads are configured to be coupled to one or more LGA corner anchor pads disposed on the second surface of the SOM;
- and
- forming one or more MLB digital signal pads on the first surface of the MLB, wherein the one or more MLB digital signal pads are configured to be coupled to one or more LGA digital signal pads disposed on the second surface of the SOM.
Dependencies are inferred from the claim text.