Method for fabricating an electronic device and a stacked electronic device
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsKarine SAXOD, Marika SORRIEUL
Life of this patent
Estimating the term…
Abstract
A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.
Claims13
A method, comprising:
- fixing a rear face of an integrated-circuit chip to a front face of a support wafer;
- depositing on a front face of the integrated-circuit chip an infused adhesive in a form of drops or segments at a distance from one another outside a central region of the front face of the integrated-circuit chip, the infused adhesive comprising a curable adhesive and solid spacer elements infused in the curable adhesive;
- placing a protective wafer on the infused adhesive so that a free space remains between the front face of the integrated-circuit chip and a rear face of the protective wafer;
- curing the curable adhesive to fix the protective wafer to the integrated-circuit chip;
- producing an intermediate peripheral ring between the integrated-circuit chip and the protective wafer after curing the curable adhesive;
- and
- producing an encapsulation ring around the integrated-circuit chip, the protective wafer, and the intermediate peripheral ring on a peripheral zone of the front face of the support wafer.
A method of collectively fabricating a plurality of electronic devices, comprising:
- forming a plurality of stacks on a support wafer, each stack formed by:
- fixing a rear face of an integrated-circuit chip on a front face of the support wafer;
- depositing on a front face of the integrated-circuit chip an infused adhesive in a plurality of drops or segments separated from each other, the infused adhesive comprising a curable adhesive and solid spacer elements infused in the curable adhesive;
- placing a protective wafer on the infused adhesive and thereby creating a free space between the front face of the integrated-circuit chip and the protective wafer;
- curing the infused adhesive to fix the protective wafer to the integrated-circuit chip;
- and
- depositing a closed intermediate peripheral ring on the integrated-circuit chip outside of the cured infused adhesive;
- and
- applying an encapsulation block on the support wafer in areas between adjacent stacks;
- and
- dicing the support wafer and the encapsulation block to form a plurality of the electronic devices.
Dependencies are inferred from the claim text.