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US 2019/0103366 A1Published application
Electronic device packages with attenuated electromagnetic interference signals
AssigneeIntel Corporation
InventorsJaejin Lee, Hao-Han Hsu, Chung-Hao J. Chen, Dong-Ho Han
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Abstract
Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.
Claims28
An electronic device package, comprising:
- a package substrate;
- an active layer operably coupled to the package substrate;
- a metallic stiffener;
- and
- a magnetic lossy bonding layer coupling the stiffener to the package substrate;
- wherein either:
- the metallic stiffener is electrically floating:
- or
- the package substrate comprises:
- a ground layer defining a plane configured to ground the electronic device Package;
- a dielectric layer coupled to the ground layer;
- a signal layer coupled to the dielectric layer;
- and
- a solder mask coupled to the signal layer.
11 more elements
(canceled)
(canceled)
A method for manufacturing an electronic device package, comprising:
- providing a substrate defining a plane;
- coupling an active layer to the substrate;
- and
- coupling a stiffener layer to the substrate with a magnetic lossy bonding layer;
- wherein the metallic stiffener is electrically floating.
2 more elements
(canceled)
A method for attenuating electromagnetic signals in an electronic device package, comprising:
- coupling a stiffener to a substrate of the electronics device package with a magnetic lossy bonding layer, such that the stiffener is shielded from at least a portion of any electromagnetic signals generated during operation of the electronic device package;
- wherein the electromagnetic signals are generated by at least one layer in the substrate.
(canceled)
Dependencies are inferred from the claim text.