US 2019/0103365 A1Published application

Selectively shielded semiconductor package

AssigneeNXP USA, Inc.

InventorsAkhilesh Kumar SINGH, Nishant Lakhera, Navas Khan Oratti Kalandar

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Abstract

Embodiments for a packaged semiconductor device are provided herein, which includes a substrate; an antenna module attached to a top surface of the substrate, the antenna module including an antenna; an electronic component attached to the top surface of the substrate, the electronic component communicatively coupled to the antenna module through electrical connections in the substrate; a first portion of mold body that encapsulates the antenna module; a second portion of mold body that encapsulates the electronic component, wherein the second portion of mold body is separated from the first portion of mold body by at least a first trench; and a shielding layer that covers the second portion of mold body.

Claims21

Dependent claims

A packaged semiconductor device comprising:

a substrate;
an antenna module attached to a top surface of the substrate, the antenna module comprising an antenna;
an electronic component attached to the top surface of the substrate, the electronic component communicatively coupled to the antenna module through electrical connections in the substrate;
a first portion of mold body that encapsulates the antenna module;
a second portion of mold body that encapsulates the electronic component, wherein the second portion of mold body is separated from the first portion of mold body by at least a first trench;
a conductive trace formed on the top surface of the substrate and under the first trench, wherein
the conductive trace follows an entire path of the first trench, and
the conductive trace makes direct contact with at least one ground contact pad;
and
a shielding layer that covers the second portion of mold body, wherein
the shielding layer directly contacts a portion of the conductive trace that is exposed in the first trench.

8 more elements

Dependencies are inferred from the claim text.