Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorSunchul KIM
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a first semiconductor chip on a first substrate, a first mold layer provided on the first substrate to cover a side surface of the first semiconductor chip, a solder structure provided on the first substrate, and a second substrate provided on the solder structure. A guide receptacle is formed at one of a top surface of the first mold layer and a bottom surface of the second substrate, a first alignment protrusion is formed at the other of the top surface of the first mold layer and the bottom surface of the second substrate, and at least a portion of the first alignment protrusion is provided in the guide receptacle.
Claims22
A semiconductor package, comprising:
- a first semiconductor chip on a first substrate;
- a first mold layer provided on the first substrate to cover a side surface of the first semiconductor chip;
- a solder structure provided on the first substrate;
- and
- a second substrate provided on the solder structure, wherein:
- a guide receptacle is formed at one of a top surface of the first mold layer and a bottom surface of the second substrate,
- a first alignment protrusion is formed at the other of the top surface of the first mold layer and the bottom surface of the second substrate, and
- at least a portion of the first alignment protrusion is provided in the guide receptacle.
(canceled)
A semiconductor package, comprising:
- a first substrate;
- a first semiconductor chip on the first substrate;
- a first mold layer provided on the first substrate to cover a side surface of the first semiconductor chip, the first mold layer comprising a first guide portion formed in a top surface thereof;
- solder structures provided on the first substrate;
- and
- an interposer substrate provided on the solder structures and spaced apart from the first semiconductor chip,
- wherein the interposer substrate comprises a first insulating protruding portion provided on a bottom surface thereof, and
- at least a portion of a side surface of the first insulating protruding portion faces a side surface of the first guide portion.
A semiconductor package, comprising:
- a first semiconductor chip on a first substrate;
- a first mold layer covering a side surface of the first semiconductor chip, the first mold layer having a first top surface and a second top surface, which is located at a level lower than the first top surface;
- a solder structure provided on the first substrate;
- and
- a second substrate provided on the solder structure,
- wherein the second substrate comprises a protruding portion provided on a bottom surface thereof,
- a bottom surface of the protruding portion is located at a level, which is lower than the first top surface of the first mold layer and is equal to or higher than the second top surface of the first mold layer, and
- the protruding portion is spaced apart from the solder structure and the first semiconductor chip when viewed in a plan view.
21-23. (canceled)
Dependencies are inferred from the claim text.