InFO-POP structures with TIVs Having Cavities
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai
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Abstract
A method includes dispensing sacrificial region over a carrier, and forming a metal post over the carrier. The metal post overlaps at least a portion of the sacrificial region. The method further includes encapsulating the metal post and the sacrificial region in an encapsulating material, demounting the metal post, the sacrificial region, and the encapsulating material from the carrier, and removing at least a portion of the sacrificial region to form a recess extending from a surface level of the encapsulating material into the encapsulating material.
Claims20
A package comprising:
- a first chip;
- a plurality of metal posts surrounding the first chip, wherein the plurality of metal posts comprises a first recessed metal post;
- an encapsulating material surrounding the first chip and the plurality of metal posts, wherein a top surface of the first recessed metal post comprises a first portion lower than a top surface level of the encapsulating material;
- a redistribution structure underlying and electrically connecting to the first chip and the plurality of metal posts;
- a plurality of connection pads underlying and electrically connecting to the redistribution structure;
- and
- a second chip electrically connecting to the first recessed metal post.
A method comprising:
- forming a sacrificial region over a carrier;
- forming a metal post over the carrier, wherein the metal post overlaps at least a portion of the sacrificial region;
- encapsulating the metal post and the sacrificial region in an encapsulating material;
- demounting the metal post, the sacrificial region, and the encapsulating material from the carrier;
- and
- removing at least a portion of the sacrificial region to form a recess extending from a surface level of the encapsulating material into the encapsulating material.
A package comprising:
- an encapsulating material;
- a metal post in the encapsulating material;
- a solder region comprising a first portion extending from a top surface of the encapsulating material into the metal post, wherein a portion of the metal post encircles the first portion of the solder region;
- and
- a device die in the encapsulating material.
Dependencies are inferred from the claim text.