Electronic device package
AssigneeIntel Corporation
InventorsDigvijay A. Raorane, Vipul V. Mehta
Life of this patent
Estimating the term…
Abstract
Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate having a top surface and a vertical surface extending downward from the top surface. The top surface and the vertical surface can define an edge. The electronic device package can also include an electronic component disposed on the top surface of the substrate and electrically coupled to the substrate. In addition, the electronic device package can include an underfill material disposed at least partially between the electronic component and the top surface of the substrate. A lateral portion of the underfill material can extend from the electronic component to at least the edge. Associated systems and methods are also disclosed.
Claims29
An electronic device package, comprising:
- a substrate having a top surface and a vertical surface extending downward from the top surface, the top surface and the vertical surface defining an edge;
- an electronic component disposed on the top surface of the substrate and electrically coupled to the substrate;
- and
- an underfill material disposed at least partially between the electronic component and the top surface of the substrate, wherein a lateral portion of the underfill material extends from the electronic component to the edge and terminates at the edge.
(canceled)
(canceled)
An electronic device package precursor, comprising:
- a substrate having a top surface configured to receive an electronic component, and a trench extending downward relative to the top surface that defines an underfill confinement boundary, wherein a depth of the trench is from about 3 μm to about 180 μm.
(canceled)
A method for making an electronic device package, comprising:
- obtaining a substrate for receiving and coupling with an electronic component;
- and
- forming a trench in a top surface of the substrate extending downward relative to the top surface, wherein the trench is configured to define an underfill confinement boundary, wherein a depth of the trench is from about 3 μm to about 180 μm.
(canceled)
Dependencies are inferred from the claim text.