Flexible chip package

A flexible chip package, comprising:

• a first flexible substrate;
• a redistribution layer disposed on the first flexible substrate;
• a second flexible substrate;
• a stress adjustment layer disposed on the second flexible substrate;
• a semiconductor chip disposed between the redistribution layer and the stress adjustment layer and electrically connected to the redistribution layer;
• and
• a bonding layer disposed between the redistribution layer and the stress adjustment layer and encapsulating the semiconductor chip, wherein the bonding layer, the redistribution layer and the stress adjustment layer are between the first flexible substrate and the second flexible substrate.

A flexible chip package, comprising:

• a first flexible substrate;
• a first redistribution layer disposed on the first flexible substrate;
• a second flexible substrate;
• a second redistribution layer disposed on the second flexible substrate;
• a semiconductor chip embedded in at least one of the first and second flexible substrates and electrically connected to at least one of the first and second redistribution layers;
• and
• an anisotropic bonding layer disposed between the first and second redistribution layers, wherein the anisotropic bonding layer, the first redistribution layer and the second redistribution layer are between the first flexible substrate and the second flexible substrate.

A flexible chip package, comprising:

• a first flexible substrate;
• a first redistribution layer disposed on the first flexible substrate;
• a second flexible substrate;
• a second redistribution layer disposed on the second flexible substrate;
• a semiconductor chip disposed at least one of the first and second redistribution layers and electrically connected to at least one of the first and second redistribution layers through a conductive material penetrating at least one of the first and the second flexible substrates;
• and
• an anisotropic bonding layer disposed between the first and second redistribution layers, wherein the anisotropic bonding layer, the first redistribution layer and the second redistribution layer are between the first flexible substrate and the second flexible substrate.