Ring-in-ring configurable-capacitance stiffeners and methods of assembling same
AssigneeIntel Corporation
InventorsJackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi, Paik Wen Ong
Life of this patent
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Abstract
Ring-in-ring stiffeners on a semiconductor package substrate includes a passive device that is seated across the ring stiffeners. The ring-in-ring stiffeners are also electrically coupled to traces in the semiconductor package substrate through electrically conductive adhesive that bonds a given ring stiffener to the semiconductor package substrate. The passive device is embedded between the two ring stiffeners to create a smaller X-Y footprint as well as a lower Z-direction profile.
Claims23
A semiconductor package, comprising:
- a package substrate including a die side and a land side;
- an inner ring stiffener and a subsequent ring stiffener disposed adjacent the inner ring stiffener, wherein each ring stiffener is seated on the die side with an electrically conductive adhesive, and wherein at least one electrically conductive adhesive is coupled to a trace within the package substrate;
- and
- a passive device electrically contacting the inner ring stiffener and the subsequent ring stiffener, wherein the subsequent ring stiffener is coupled to ground and the inner ring stiffener is coupled to a power connection.
A method of assembling a stiffener to a semiconductor package substrate, comprising:
- seating an inner ring stiffener and a subsequent ring stiffener upon a die side of a semiconductor package substrate, wherein the semiconductor package substrate also includes a land side;
- forming a trench in each of the inner ring stiffener and the subsequent ring stiffener to achieve a passive-device seat;
- forming electrical connections at the passive-device seat between the inner ring stiffener and the subsequent ring stiffener;
- and
- assembling a passive device to the electrical connections between the ring stiffeners.
A computing system, comprising:
- a first die and a supplemental die seated on semiconductor package substrate die side, wherein the semiconductor package substrate also includes a land side;
- an inner ring stiffener and a subsequent ring stiffener disposed adjacent the inner ring stiffener, wherein each ring stiffener is seated on the die side with an electrically conductive adhesive, and wherein at least one electrically conductive adhesive is coupled to a trace within the package substrate;
- and
- a passive device electrically contacting the inner ring stiffener and the subsequent ring stiffener, wherein the subsequent ring stiffener is coupled to ground and the inner ring stiffener is coupled to power connections;
- a ball-grid array disposed on the land side;
- and
- a board electrically contacting the ball-grid array, wherein the board includes an outer shell that is electrically and physically insulative for the first die and the supplemental die.
Dependencies are inferred from the claim text.