Electronic device packaging

An electronic system, comprising:

• a first package, including:
• a first substrate having a first mounting surface,
• a first die coupled to the first mounting surface,
• a first interconnect region laterally spaced from the first die,wherein the first interconnect region includes one or more pads coupled to the first mounting surface, and
• one or more traces configured to establish one or more electrical communication pathways between the first die the one or more pads of the first interconnect region;
• a second package, including:
• a second substrate having a second mounting surface,
• a second die coupled to the second mounting surface,
• a second interconnect region laterally spaced from the second die,wherein the interconnect region includes one or more pads coupled to the second mounting surface, and
• one or more traces configured to establish one or more electrical communication pathways between the second die and the one or more pads of the second interconnect region;
• and
• wherein the one or more pads of the first interconnection region are interconnected with the one or more pads of the second interconnection region and the interconnection establishes one or more electrical communication pathways between the first package and the second package.

A method for manufacturing an electronic system, comprising:

• coupling a first die to a first mounting surface of a first substrate, wherein the first mounting surface includes a first interconnect region laterally spaced from the first die;
• interconnecting the first interconnect region with a second interconnect region, wherein the second interconnect region is included in a second mounting surface of a second substrate and a second die is coupled to the second mounting surface;
• and
• wherein interconnecting the first interconnect region with the second interconnect region establishes one or more electrical communication pathways between the first substrate and the second substrate.