Methods of forming semiconductor devices
AssigneeMicron Technology, Inc.
InventorsWilliam R. Brown, Jenna L. Russon, Tim H. Bossart, Brian R. Watson, Nikolay A. Mirin, David A. Kewley
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AssigneeMicron Technology, Inc.
InventorsWilliam R. Brown, Jenna L. Russon, Tim H. Bossart, Brian R. Watson, Nikolay A. Mirin, David A. Kewley
Estimating the term…
A semiconductor device including conductive lines is disclosed. First conductive lines each comprise a first portion, a second portion, and an enlarged portion, the enlarged portion connecting the first portion and the second portion of the first conductive line. The semiconductor device includes second conductive lines, at least some of the second conductive lines disposed between a pair of the first conductive lines, each second conductive line including a larger cross-sectional area at an end portion of the second conductive line than at other portions thereof. The semiconductor device includes a pad on each of the first conductive lines and the second conductive lines, wherein the pad on each of the second conductive lines is on the end portion thereof and the pad on each of the first conductive lines is on the enlarged portion thereof.
A method of forming a semiconductor device, the method comprising:
A method of forming a semiconductor device, the method comprising:
A method of forming a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.