Integrated embedded substrate and socket
AssigneeIntel Corporation
InventorsRam VISWANATH, Srikant NEKKANTY
Life of this patent
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Abstract
An apparatus is provided which comprises: a substrate material comprising one or more embedded copper planes, one or more plated through holes through the substrate material, one or more metal contacts, the metal contacts comprising a substantially straight section coupled with adhesive within the one or more plated through holes, and a cantilever spring section extending beyond a first surface of the substrate material, and one or more conductive contacts on a second surface of the substrate material, opposite the first surface, the conductive contacts coupled with the metal contacts. Other embodiments are also disclosed and claimed.
Claims25
An apparatus comprising:
- a substrate material comprising one or more embedded copper planes;
- one or more plated through holes through the substrate material;
- one or more metal contacts, the metal contacts comprising a substantially straight section coupled with adhesive within the one or more plated through holes, and a cantilever spring section extending beyond a first surface of the substrate material;
- and
- one or more conductive contacts on a second surface of the substrate material, opposite the first surface, the conductive contacts coupled with the metal contacts.
A system comprising:
- an integrated circuit device package;
- and
- a socket coupled with the integrated circuit device package, wherein the socket comprises:
- a substrate material comprising one or more embedded copper planes;
- one or more plated through holes through the substrate material;
- one or more metal contacts, the metal contacts comprising a substantially straight section coupled with adhesive within the one or more plated through holes, and a cantilever spring section extending beyond a first surface of the substrate material;
- and
- one or more conductive contacts on a second surface of the substrate material, opposite the first surface, the conductive contacts coupled with the metal contacts.
A method comprising:
- forming a substrate with one or more embedded copper planes;
- drilling one or more holes through the substrate;
- plating the one or more holes;
- inserting one or more metal contacts into the one or more plated holes, wherein the one or more metal contacts comprise a cantilever spring section extending beyond a first surface of the substrate;
- adhering the one or more metal contacts within the one or more plated holes;
- and
- forming one or more conductive contacts on a second surface of the substrate, opposite the first surface, the one or more conductive contacts coupled with the one or more metal contacts.
Dependencies are inferred from the claim text.