Constrained cure component attach process for improved ic package warpage control

An apparatus, comprising:

• a first platform comprising a first working surface having a first non-planar portion;
• and
• a second platform comprising a second working surface having a second non-planar portion, wherein:
• the second working surface is opposite the first working surface,
• a distance between the first working surface and the second working surface is adjustable,
• the first non-planar portion comprises a protruding portion, and
• the second non-planar portion comprises a recessed portion opposite the protruding portion, wherein the second non-planar portion comprises three protrusions comprising a middle protrusion equidistant between two peripheral protrusions, and wherein a z-height of the two peripheral protrusions is larger than a z-height of the middle protrusion.

An apparatus, comprising:

• a first platform comprising a first working surface having a first non-planar portion;
• and
• a second platform comprising a second working surface having a second non-planar portion, wherein:
• the second working surface is opposite the first working surface,
• a distance between the first working surface and the second working surface is adjustable,
• the first non-planar portion comprises a protruding portion, and
• the second non-planar portion comprises a recessed portion opposite the protruding portion, wherein the first platform comprises a first cavity, and wherein the first platform comprises ports extending from an exterior wall of the first platform to the first cavity.