Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the same
AssigneeInfineon Technologies AG
InventorsChristian NEUGIRG, Peter Scherl
Life of this patent
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Abstract
A semiconductor chip package may comprise a semiconductor chip disposed on a substrate. The semiconductor chip may have a first surface and a second surface. The first surface of the semiconductor chip may be connected to the substrate. The semiconductor chip package may comprise a leadframe that includes a first lead and a second lead. The first lead of the leadframe may be directly attached to the second surface of the semiconductor chip. The second lead of the leadframe may be directly attached to the substrate.
Claims20
A semiconductor chip package, comprising:
- a semiconductor chip disposed on a substrate,
- wherein the semiconductor chip has a first surface and a second surface, and
- wherein the first surface of the semiconductor chip is connected to the substrate;
- and
- a leadframe that includes a first lead and a second lead,
- wherein the first lead of the leadframe is directly attached to the second surface of the semiconductor chip, and
- wherein the second lead of the leadframe is directly attached to the substrate.
A method for fabricating a semiconductor chip package, the method comprising:
- disposing a semiconductor chip on a substrate,
- wherein the semiconductor chip has a first surface and a second surface, and
- wherein the first surface of the semiconductor chip is connected to the substrate;
- attaching a first lead of a leadframe to the second surface of the semiconductor chip;
- and
- attaching second lead of the leadframe to the substrate.
An electronic module, comprising:
- at least one semiconductor chip package comprising:
- a semiconductor chip disposed on a substrate,
- wherein a first surface of the semiconductor chip is connected to the substrate;
- and
- a leadframe that includes a first lead and a second lead,
- wherein the first lead of the leadframe is directly attached to a second surface of the semiconductor chip, and
- wherein the second lead of the leadframe is directly attached to the substrate.
Dependencies are inferred from the claim text.