Flexible semiconductor package and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsAtapol PRAJUCKAMOL, Soon Wei WANG, Hoe Kit Liew How Kat LEY
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Abstract
Implementations of semiconductor packages may include a die including a first side and a second side opposing the first side, the second side of the die coupled to a layer, a first end of a plurality of wires each bonded to the first side of the die, a mold compound encapsulating the die and the plurality of wires, and a second end of the plurality of wires each directly bonded to one of a plurality of bumps, wherein a surface of the layer is exposed through the mold compound.
Claims19
A method of forming a semiconductor package comprising:
- coupling a plurality of die to a metal sheet;
- bonding a plurality of wires to a first side of each die;
- bonding the plurality of wires to the metal sheet;
- applying a mold compound over each die and the plurality of wires;
- exposing an end of each wire of the plurality of wires through removing the metal sheet;
- and
- singulating the mold compound through removing a portion of the mold compound to form a plurality of semiconductor packages.
A method of forming a semiconductor package comprising:
- coupling a plurality of die to a metal sheet, each die comprising a non-electrically conductive layer between the die and the metal sheet;
- bonding a plurality of wires to a first side of each die opposing the non-electrically conductive layer and bonding the plurality of wires to the metal sheet;
- applying a mold compound over each die and the plurality of wires;
- exposing an end of each wire of the plurality of wires through removing the metal sheet;
- and
- singulating the mold compound to form a plurality of semiconductor packages.
A method of forming a semiconductor package comprising:
- coupling a plurality of die to a metal sheet, each die comprising a wafer backside coating between the die and the metal sheet;
- bonding a plurality of wires to a first side of each die opposing the wafer backside coating and bonding the plurality of wires to the metal sheet;
- applying a mold compound over each die and the plurality of wires;
- exposing an end of each wire of the plurality of wires by peeling away the metal sheet;
- forming and patterning a photoresist layer over the mold compound and over the wafer backside coating;
- forming an electrically conductive layer over each exposed end of each wire;
- removing the photoresist layer;
- and
- singulating the mold compound to form a plurality of semiconductor packages.
Dependencies are inferred from the claim text.