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US 2019/0103337 A1Published application
Flexible semiconductor package and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsAtapol PRAJUCKAMOL, Soon Wei WANG, Hoe Kit Liew How Kat LEY
Life of this patent
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Abstract
Implementations of semiconductor packages may include a die including a first side and a second side opposing the first side, the second side of the die coupled to a layer, a first end of a plurality of wires each bonded to the first side of the die, a mold compound encapsulating the die and the plurality of wires, and a second end of the plurality of wires each directly bonded to one of a plurality of bumps, wherein a surface of the layer is exposed through the mold compound.
Claims19
A semiconductor package comprising:
- a die comprising a first side and a second side opposing the first side;
- a first end of a plurality of wires each bonded to the first side of the die;
- a mold compound encapsulating the die and the plurality of wires, wherein the mold compound comprises a first side and a second side opposite the first side;
- and
- a second end of the plurality of wires each exposed through the second side of the mold compound;
- wherein a plurality of sidewalls of the mold compound are substantially perpendicular with the second side of the die.
3 more elements
A semiconductor package comprising:
- a die comprising a first side and a second side opposing the first side, the second side of the die coupled to a layer;
- a first end of a plurality of wires each bonded to the first side of the die;
- a mold compound encapsulating the die and the plurality of wires, wherein the mold compound comprises a first side and a second side opposite the first side;
- and
- a second end of the plurality of wires each exposed through the second side of the mold compound;
- wherein a surface of the layer is exposed through the second side of the mold compound;
- and
- wherein a plurality of sidewalls of the mold compound are substantially perpendicular with the surface of the layer exposed through the mold compound.
5 more elements
Dependencies are inferred from the claim text.