Electronic component-embedded board
AssigneeShinko Electric Industries Co., Ltd.
InventorsShigeru Mizuno, Tomoya Kubo, Katsuya Fukase
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Abstract
There is provided an electronic component-embedded board. The electronic component-embedded board includes: a first insulating layer; a metal layer formed on the first insulating layer; a first electronic component disposed on the metal layer; a second insulating layer formed on the first insulating layer and the metal layer such that the first electronic component is buried in the second insulating layer; a second electronic component disposed above the second insulating layer; and a heat radiating member thermally connected to the metal layer exposed from the second insulating layer and thermally connected to the second electronic component.
Claims9
An electronic component-embedded board comprising:
- a first insulating layer;
- a metal layer formed on the first insulating layer;
- a first electronic component disposed on the metal layer;
- a second insulating layer formed on the first insulating layer and the metal layer such that the first electronic component is buried in the second insulating layer;
- a second electronic component disposed above the second insulating layer;
- and
- a heat radiating member thermally connected to the metal layer exposed from the second insulating layer and thermally connected to the second electronic component.
Dependencies are inferred from the claim text.