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US 2019/0103334 A1Published application
Semiconductor apparatus
AssigneeMitsubishi Electric Corporation
InventorHiroki TANAKA
Life of this patent
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Abstract
A semiconductor apparatus includes: a radiator plate; a resin insulating layer provided on the radiator plate; a resin block made of resin and armularly disposed to cover an end part of the radiator plate and an end part of the resin insulating layer; a case disposed to cover the resin block; and a sealing material filled in an inside of the case.
Claims17
A semiconductor apparatus comprising:
- a radiator plate;
- a resin insulating layer provided on the radiator plate;
- a resin block made of resin and annularly disposed to cover an end part of the radiator plate and an end part of the resin insulating layer;
- a case disposed to cover the resin block;
- and
- a sealing material filled in an inside of the case,
- wherein the entire resin block is separated from the sealing material by an adhesive material.
4 more elements
Dependencies are inferred from the claim text.