Semiconductor apparatus
AssigneeMitsubishi Electric Corporation
InventorsNobuchika AOKI, Rei YONEYAMA, Akira GOTO, Akihiko YAMASHITA
Life of this patent
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Abstract
A semiconductor apparatus includes: a case made of resin; an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in a L shape with respect to a second terminal of the external terminal portion and having a first surface exposed from the case and an anchor part in close contact with the case; and a bonding wire bonded to the first surface of the internal terminal portion.
Claims16
A semiconductor apparatus comprising:
- a case made of resin;
- an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in an L shape with respect to a second terminal of the external terminal portion, the internal terminal portion having a first surface exposed from the case and an anchor portion, the anchor portion being in close contact with the case and including one of:
- a concave portion provided on a second surface of the internal terminal portion that faces in a direction opposite to a direction in which the first surface faces, and
- a convex portion provided on the second surface of the internal terminal portion that faces in the direction opposite to the direction in which the first surface faces;
- and
- a bonding wire bonded to the first surface of the internal terminal portion.
A semiconductor apparatus comprising:
- a case made of resin;
- an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in an L shape with respect to a second terminal of the external terminal portion and having a first surface exposed from the case and an anchor portion in close contact with the case;
- and
- a bonding wire bonded to the first surface of the internal terminal portion,
- wherein the anchor portion is a first bent portion provided in an extending direction of the internal terminal portion and bent to be embedded in the case.
A semiconductor apparatus comprising:
- a case made of resin;
- an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in an L shape with respect to a second terminal of the external terminal portion and having a first surface exposed from the case and an anchor portion in close contact with the case;
- and
- a bonding wire bonded to the first surface of the internal terminal portion,
- wherein the anchor portion is a side face bent portion provided on a side face side of the internal terminal portion and bent to be embedded in the case.
Dependencies are inferred from the claim text.