Three-dimensional (3d) inductor-capacitor (lc) circuit

A method for improving a quality factor (Q-factor) of a three-dimensional (3D) inductor-capacitor (LC) circuit comprising:

• forming an inductor by a conductive ribbon, wherein:
• the inductor comprises an inner electrode portion, an outer electrode portion, and a winding portion extending between the inner electrode portion and the outer electrode portion;
• and
• the conductive ribbon comprises opposing sidewalls having a defined height that equals at least twice a thickness of the conductive ribbon and is provided in a substrate with the opposing sidewalls being perpendicular to a top surface and a bottom surface of the substrate;
• providing a conductive sleeve, comprising:
• disposing a conductive sidewall along the outer electrode portion, wherein the outer electrode portion is between the conductive sidewall and the inner electrode portion;
• disposing a conductive top plate above at least a portion of the conductive ribbon and conductively coupled to the inner electrode portion and the conductive sidewall;
• and
• disposing a conductive bottom plate disposed below at least a portion of the conductive ribbon and conductively coupled to the inner electrode portion and the conductive sidewall;
• and
• generating at least one capacitance by the conductive sleeve and the conductive ribbon.